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		HOME > ȸ»ç¼Ò°³ > ¿¬±¸°³¹ß > º¥Ã³ÅõÀÚ       ȸ»ç¸í :    Erlang Technology, Inc. »ç¾÷¿µ¿ª :   ASIC/ASSP Design and Development ¿Ü ÁÖ¼Ò :   345 Marshall Ave, suite #300, Webster Groves,   Mo 63119, U.S.A ¿¬¶ôó :   Tel)1-314-336-5900, E-mail : gregm@erlangtech.com   Çѱ¹Áö»ç : 02-538-2313 (E-mail : erlang@erlang.co.kr) ȨÆäÀÌÁö :   www.erlangtech.com ȸ»ç¿¬Çõ :   '99³â 3¿ù 30 ÀÏ ¼³¸³ ´ëÇ¥ÀÌ»ç :   Gregory R. Miller (CEO/President) ´ëÇ¥ÀÌ»ç¾à·Â :   ¹Ì±¹ Minnesota University(MHA), IOWA University (MBA)     Board of Directors of First Community Bank (USA)       ENET Switch Fabric Chip set Family   Two component chip set consisting of XeC (core fabric) and Xel (interposer)   ENET SE   Scalable up to 40 Gb/s,64 OC-12c,16 OC-48c channels or any combination SeC 10 Gb/s chip core fabric , Sel 5 Gb/s chip interposer, Supports POS-PHY interface ENET XE   Scalable up to 640 Gb/s 256 OC-48c, 64 OC-192c, 16 OC-768c channels or any combination XeC 80 Gb/s chip core fabric, Xel 10 Gb/s chip interposer Supports POS-PHY and CSIX interface Intergrated with several leading edge network processors and traffic managers Multi-channel switching enabling parallelism while maintaining sequence ENET TE   Scalable up to 5 Tb/s STN-LCD ¹× ¹ÝµµÃ¼¿þÀÌÆÛ¿ë ¿¬¸¶¿¡ »ç¿ëµÇ´ÂINSERTs & 32 OC-3072 channel or any combination TeC 640 Gb/s chip core fabric, Tel 80 Gb/s chip interposer 32 OC-3072 channels       Switch Fabric Integration Family   enable quick system development and allows systems companies to focus on building   differentiated services in their box.       ENETISv1.0 : 10 Gb/s development board, Utilizes Sel/SeC ASSPs       ENETISv2.0 : 40 Gb/s fully functional switch/router, Utilizes Sel/SeC ASSPs       ENETISv3.0 : 80 Gb/s developmental board, Utilizes Xel/XeC ASSPs       Erlang Technology, Inc´Â ¹Ì±¹ ¹ÌÁÖ¸®ÁÖ St. Louis¿¡ ¼ÒÀçÇÑ fabless semiconductor     company ·Î Network Àåºñ, Core Access¿ë switch fabric components ¸¦ ¼³°è,°³¹ß     ÆǸÅÇϴ ȸ»çÀÌ´Ù        Æ¯È÷, Switching Solution ºÐ¾ß¿¡¼­ ¼¼°è Á¤»ó±ÞÀÇ ±â¼ú·Â°ú ´Ù¼öÀÇ Intellectual Proper     ties¸¦¸¦ º¸À¯ÇÏ°í ÀÖ´Ù. ÇöÀç 40¿©¸íÀÇ Á÷¿øÀÌ ÀÖÀ¸¸ç ÀÌ °¡¿îµ¥ 80% °¡ ¿¬±¸°³¹ß ºÎ¹®     ¿¡ ±Ù¹«ÇÏ°í 15¸íÀÌ ¹Ú»ç±ÞÀÌ´Ù.        ¼³¸³ÀÚÀ̸ç ÇöÀç Chief of Scientist·Î ÀÖ´Â Paul Min ¹Ú»ç´Â Washington University,       in St. Louis ÀÇ ±³¼ö·Î ÀçÁ÷ ÁßÀ̸ç À¯¸íÇÑ RGIT(Research Group in Telecommunica     tions) ÀÇ ÇÙ½É Member·Î RGIT °¡ ¼öÇàÇÑ ´Ù¼öÀÇ switch fabric chipsetsÀÇ °³¹ß Proje     ctÀÇ Leader·Î Âü¿©ÇÏ¿´´Ù.

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